XTEM preparation kit M180

  • Description
  • Specification
  • Accesories
  • Consumables


The XTEM Prep Kit makes it easy to stack and bond together rectangular wafers obtained from the area of interest of the bulk material. A vise assembly holds the wafers in place while the vacuum-compatible epoxy is curing. The wafer stack is subsequently cored and sectioned into disk specimens. The XTEM Prep Kit produces specimens with a high level of mechanical integrity and a consistent glue layer thickness. The kit includes all components needed to produce high-quality, cross-section specimens.

For the study of interfaces by transmission electron microscopy, it is critical to align the interface of interest parallel to the incident electron beam. One method for preparing such samples is to fabricate cross-section specimens. Typical cross-section specimens include semiconductor devices, specimens with thin film layers, and composite materials.

Key Specifications

  • Fabricate precise cross-section specimens for transmission electron microscopy
  • Aligns area of interest
  • Produces consistent glue layer thickness


Kit components

Spring-type vise assembly (1 each)

Stack mounting plate assembly (1 each)

2.3 mm diam titanium cutting tool (1 each)

4 mm x 5 mm titanium cutting tool (1 each)

Slice holder, 2 mm x 3 mm (1 each)

Slice holder, 4 mm x 5 mm (1 each)

Mixing dish (3 each)

PTFE (polytetrafluoroethylene) mold (2 each)

CrystalbondE adhesive sticks, pack of 12 (1 each)

Brass tubes, pack of 12 (1 each)


The Model 170 Ultrasonic Disk Cutter rapidly cuts transmission electron microscopy (TEM) specimens from hard, brittle materials without mechanical or thermal damage. It produces disk specimens from materials as thin as 10 µm or cylindrical rods up to 10 mm long from bulk samples or rectangular wafers that are subsequently used in the preparation of cross-section TEM specimens.

Its unique design means that the specimen is always presented parallel to the cutting axis. An optional microscope facilitates site-specific cutting by helping to locate an area of interest in the bulk material. A dial indicator accurately displays the depth of the cutting tool. The process is automatically terminated once the specimen has been cut.The cutting tool movement is caused by the excitation of lead zirconate titanate crystals oscillating at a frequency of 26 kHz.

The cutting medium is an abrasive slurry of either boron nitride or silicon carbide. Tool motion is optimized to cut at the maximum rate while minimizing mechanical and thermal specimen damage.


Klej Crystalbond

Siatki TEM z kwadratową strukturą – niklowe

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