NANO – Robotics Solutions for Electron Microscopes

Description

Integrated nanoprobing solutions for SEM and FIB. Bring probe tips in contact with semiconductor chips, measure the electrical characteristics of integrated components, localize defects and isolate structures.

Imina Technologies’ NANO solutions are turnkey for electrical characterization of microelectronic devices, in situ semiconductor failure analysis and manipulation of single structures in SEM and FIB chambers. Fully controlled from Precisio™ software suite, comprehensive workflows provide operator assistance from setting up the system, to landing probe tips on the device under test, acquiring and processing measurements and reporting.

Up to 8 miBot™ nanoprobers can be delivered with various configurations and options to adapt to application specific requirements and equipment setups.

The compact and light platforms for the robots are compatible with any electron microscope and can either be mounted on the SEM sample positioning stage, or be loaded via the SEM load-lock.

The compatibility with high resolution imaging using magnetic lenses enables the operator to perform nanoprobing experiments with the most advanced scanning electron microscopes on the market and take advantage of the highest resolution imaging capabilities, even at accelerating voltages below 0.5 kV.

As the whole platform and robots can be tilted, in situ FIB circuit editing and nanoprobing can be performed simultaneously providing faster and more accurate failure analysis results.

No permanent modification of the chamber is required and the installation and removal of the system only takes a few minutes. This avoids to dedicate an SEM for nanoprobing. Also, various extra accessories exist to easily operate the main components of a NANO solution under optical microscopes such as probe stations and inspection tools, increasing the value of your investment.

Applications:

Semiconductor characterization

─ I/V curves of single transistors

─ Bit cell memories characterization

─ IC attacks for cybersecurity, reverse engineering

Failure Analysis (FA)

─ EBIC: Electron Beam Induced Current

Defects localization at p/n junction

─ EBAC/RCI: Electron Beam Absorbed Current

Shorts/Opens detection at metal lines

Materials characterization and nano-manipulation

─ 4-point probing on single structures

─ Thin-film characterization

─ Single structure isolation (nanowires, particles, etc), TEM sample preparation